Solution

Advantages of the process:

1. The connecting lamination stack has good rigidity to ensure that the lamination is mechanically stable.

2. For motor lamination processed by different processes, when the same magnetic field strength needs to be achieved under J=1.0T, the magnetic induction data required for bonding the lamination stack is minimal. The following materials can be selected to meet the needs of the motor.

3. For motor lamination stacks processed by different processes, the iron loss data of the bonded lamination stack is the smallest at 50-400HZ. Under the same condition, the motor assembled with the bonded lamination stack has the lowest power loss and better motor performance.

4. The temperature rise of a motor assembled with a bonded lamination stack is significantly lower than that of a motor assembled with a riveted lamination stack. Under different frequency conditions, the noise of a motor assembled with a bonded lamination stack is 4-13dB lower than that of a motor assembled with a welded lamination stack.


Process Disadvantages:

1. During the production process, the bonded lamination stack is affected by the bonding and solidification time of the lamination stack. The stamping speed of the lamination stack is 30-50% lower than the speed of buckling or welding the lamination stack. Therefore, the production capacity of the bonded lamination stack is lower. The processing cost of the lamination stack is higher than that of lamination stacks made by other conventional forming methods.

2. The raw materials used for bonding the lamination stack are special coating materials or self-adhesive coating materials suitable for bonding. In-mold dispensing to bond the lamination stack requires the use of special glue and catalysts, and self-adhesive lamination stacks use self-adhesive coating materials, the cost of special glue or self-adhesive coating materials used in bonding molding is higher than that of conventional molding methods.

3. Due to the temperature resistance of the adhesive used for bonding, the subsequent processing of the bonded lamination stack cannot exceed 200°C,so the bonded lamination stack cannot use high-temperature stress relief annealing process


Summary of advantages and disadvantages of bonded lamination stack

Advantage

1. The bonded lamination stack has good rigidity and high bonding strength.

2. The bonded lamination stack has low loss and excellent electromagnetic properties.

3. The bonded lamination stack has low temperature rise, low noise, and long motor life.


Disadvantages

1. The stamping efficiency is low and the processing cost is slightly high.

2. Special materials are required and the material cost is high

3. The bonded lamination stack has a temperature resistance of 180°C and cannot be processed at high temperatures in the subsequent process.


To sum up, bonded lamination stacks are usually used in industries that require high motor performance, such as new energy vehicles, aerospace, rail transit, military research, navigation exploration, precision machine tools, and high-speed motors.